MediaTek on Tuesday unveiled the Dimensity 8300 as the corporate’s newest processor for Android smartphones. Constructed on TSMC’s superior second-generation 4nm course of expertise, it options 20 % improved efficiency and 30 % much less energy consumption over its predecessor. The corporate’s new chipset provides full generative AI help, together with massive language fashions (LLMs) and expertise similar to Secure Diffusion. The chip helps up 320-megapixel cameras and 5G community downlink speeds of as much as 5.17Gbps, based on the corporate.
The newly unveiled Dimensity 8300 cellular processor is an octa-core chip with 4 Arm Cortex-A715 efficiency cores and 4 Cortex-A510 effectivity cores, clocked at 3.35GHz and a couple of.2GHz, respectively. It helps LPDDR5x member and UFS 4 storage with Multi-Round Queue (MCQ) help. Earlier benchmark scores recommend that this chip can sustain with Qualcomm’s second strongest chip, the Snapdragon 8 Gen 2 SoC.
Along with the aforementioned CPU enhancements, the chip has a Mali-G615 GPU that’s claimed to make use of 55 % much less energy whereas providing 60 % improved efficiency over final yr’s mannequin. The chip additionally options MediaTek’s HyperEngine recreation expertise that screens gadget temperature and retains gadget from working scorching throughout gaming classes, based on the corporate.
For photographs and movies, the MediaTek Dimensity 8300 options an Imagiq 980 ISP that’s claimed to supply 4K60fps HDR with help for longer video recording, on account of enhancements to energy consumption. it helps smartphone cameras with a most decision of 320 megapixels.
MediaTek has geared up the Dimensity 8300 with an APU 780 AI processor with an analogous structure because the extra superior Dimensity 9300 chipset, resulting in a 2x and three.3x improve in efficiency in INT/FP16 computation and AI efficiency, respectively. In the meantime, it helps on-device generative AI expertise with as much as 10 billion parameters in addition to help for Secure Diffusion, based on the chipmaker.
On the connectivity entrance, the brand new Dimensity 8300 has a 3GPP Launch-16 modem with 5G and 4G LTE help. The chipset additionally comes with Wi-Fi 6E and Bluetooth 5.4 help, together with GPE, GLONASS, and NavIC help for GPS-based navigation.
Based on MediaTek, 5G handsets working on the newly unveiled Dimensity 8300 chip can be launched earlier than the top of the yr. The chip is predicted to compete with Qualcomm’s Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 chips. Whereas particular fashions that includes the MediaTek chip are but to be introduced, we are able to count on to see smartphone makers announce upcoming fashions that includes the cellular chipset within the coming weeks and months.
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